3D printing as a new packaging approach for MEMS and electronic devices

G. Aspar, B. Goubault, O. Lebaigue, J. C. Souriau, G. Simon, L. Di Cioccio, Y. Brechet

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

9 Citations (Scopus)

Abstract

In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography and Fused Deposition Molding, were studied. The work described in this paper opens plenty of new approaches: device design with a customizable backend packaging process, packaging adapted to each different component, even on the same device, fast device prototyping with accurate characteristics, among others. Our main observation is that the stereolithography technology is compatible with microelectronics substrates. Another technology, fused deposition molding, was also tested, but was not well adapted to packaging components, the major incompatibilities being the inability to print on silicon and some coarser dimensions than those required for microelectronic applications. We argue that specific patterns for the printed structure and compatibility between substrate and printed material (which can be improved with surface modifications) are key requirements to obtain the expected results.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages1071-1079
Number of pages9
ISBN (Electronic)9781509043323
DOIs
Publication statusPublished - 2017
Externally publishedYes
EventElectronic Components and Technology Conference 2017 - Lake Buena Vista, United States of America
Duration: 30 May 20172 Jun 2017
Conference number: 67th
https://ieeexplore.ieee.org/xpl/conhome/7998598/proceeding (Proceedings)

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components and Technology Conference 2017
Abbreviated titleECTC 2017
CountryUnited States of America
CityLake Buena Vista
Period30/05/172/06/17
Internet address

Keywords

  • 3D printing
  • Additive manufacturing
  • Electronic component
  • MEMS
  • Packaging
  • Polymers

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