Integrated Industry 4.0 Solution for PCB Assembly: Cobot-Assisted Pick and Place with IoT-Enabled Quality and Operational Analytics Through Digitization Smart System

Kok Hoe, Ho (Primary Chief Investigator (PCI))

Malaysia School of Engineering

Project: Research

Project Description

Crest Funding Application (Fasttrack Design & Development and Innovation Project Proposals from Small Medium Enterprise) 2024.

Status	Active
Effective start/end date	1/10/24 → 30/09/25

Keywords

Robotic
Industry 4.0
Internet of Things
Semiconductor
Printed Circuit Board
Smart System
Operational Analytics
Digital Manufacturing